ibex platform
For MRAM TEST
LINX-WS
Sensor Tester
ASK FOR
A DEMO
Accelerate Your
MRAM Innovation
Our equipment integrates directly into your ATE flow, giving you fast magnetic stimulus, stable conditions, and the flexibility to characterize even the most complex sensor designs.
By reducing test bottlenecks and improving measurement consistency, Hprobe helps your teams fine-tune designs faster and achieve a smoother, more predictable path to volume production.
Advanced
Test Features
Comprehensive xMR Sensor Coverage
Dedicated to testing TMR, GMR, and AMR technologies.
Hall Effect Compatibility
Supports advanced Hall sensor characterization and testing.
3D Magnetic Field Testing
Enables full characterization and high-throughput production under 3D fields.
ATE Integration
Fully compatible with commercial automated test equipment.
Flexible Probe Card Operation
Works with manual or automatic probe card loading.
200mm & 300mm Compatibility
Seamless operation on automated wafer probers.
Linx
characteristics
LINX by Hprobe validates chip performance at wafer level by combining electrical probing with controlled magnetic field application ensuring fast, reliable, and cost-effective testing.
Wafer-level testing with LINX includes:
- Static magnetic field measurements (1D, 2D, 3D)
- Apply a stable magnetic field in any direction and capture the sensor’s electrical response for precise characterization.
- Enables vectorial magnetic field generation above 200 millitesla (mT) in any direction of space, reaching over 500 mT in-plane and more than 250 mT out-of-plane
- Dynamic field sweeps for high-throughput sorting:
- Sweep the magnetic field in amplitude or angle to quickly test all devices on the wafer, enabling full coverage while minimizing test time and cost.
